The forming of a resin/fiber material into a solid mass of prescribed shape and size
Electronic Molding Compounds
Protect active and passive components, such as ceramic and tantalum capacitors and resistors. Designed for both automolds and conventional molds.
A broad category of molding products.
Low Pressure Molding
Henkel’s line of Macromelt products, now proudly marketed under the Technomelt brand, is widely recognized as an industry leader in low-pressure molding compounds. These thermoplastic hotmelts use extremely low pressure to effectively encapsulate even the most delicate circuitry. Macromelt cycle time is fast and processing temperatures are a modest 130 to 240°C, with in-use temperatures ranging from –40 to +140°C. As compared to traditional potting and encapsulating processes, Macromelt is superior, offering short cycle times, low-pressure molding and maximum yield with minimal material waste.
Polyamide Low Pressure Molding Compounds
Polyolefin Low Pressure Molding Compounds
Opto Molding Compounds
Mold compounds designed with high optical properties. Typical applications would include (LED's) light emitting diodes used in many lighting applications including brake lights, flash lights, and standard electronic equipment like DVD's as indicator lights.
Semiconductor Molding Compounds
Molding materials are used to encapsulate semiconductor packaging. Integrated Circuits (IC) are bonded down to packaging with die attach materials and encapsulated with mold compounds to protect the circuit. Applications include TSOP's QFP's, QFN's, SOIC's, CSP's, BGA's along with several other standard SMT devices.
Tantalum Capacitor Molding
Resistor Network Molding
Through-Hole Discretes, High Thermal Conductivity
Through-Hole Discretes, High Voltage Applications
Surface Mount / Lead Frames
Surface Mount / Laminates
Green Molding Compounds
Non-Green Molding Compounds
Other Semiconductor Molding Compounds